General high-speed PCB material requirements are as follows:
1. Low loss, CAF/heat resistance and mechanical toughness (adhesion) (good reliability)
2. Stable Dk/Df parameters (small coefficient of change with frequency and environment)
3. Small tolerance of material thickness and glue content (well controlled imped……
What is HDI
The English abbreviation of HDI (High Density Interconnection) high density interconnection PCB is the abbreviation of multi-layer buried/blind hole PCB produced by laser drilling, horizontal/vertical PTH wet process and other processes on the basis of traditional multi-layer circuit board manufacturing te……
With the development and construction of 5G communication, the demand for high-frequency high-speed boards in the electronic equipment industry is growing. Due to different use environments, high-frequency boards and high-speed boards have many common features and some differences. In this paper, the characteristics of……
The heat generated by electronic equipment during operation makes the internal temperature of the equipment rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, and the reliability of electronic equipment will decline due to overheating effect. Therefore, it is very important to ……
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